18 research outputs found

    An endoscopie imaging system based on a two-dimensional CMUT array: real-time imaging results

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    Real-time catheter-based ultrasound imaging tools are needed for diagnosis and image-guided procedures. The continued development of these tools is partially limited by the difficulty of fabricating two-dimensional array geometries of piezoelectric transducers. Using capacitive micromachined ultrasonic transducer (CMUT) technology, transducer arrays with widely varying geometries, high frequencies, and wide bandwidths can be fabricated. A volumetric ultrasound imaging system based on a two-dimensional, 16×l6-element, CMUT array is presented. Transducer arrays with operating frequencies ranging from 3 MHz to 7.5 MHz were fabricated for this system. The transducer array including DC bias pads measures 4 mm by 4.7 mm. The transducer elements are connected to flip-chip bond pads on the array back side with 400-μm long through-wafer interconnects. The array is flip-chip bonded to a custom-designed integrated circuit (IC) that comprises the front-end electronics. Integrating the front-end electronics with the transducer array reduces the effects of cable capacitance on the transducer's performance and provides a compact means of connecting to the transducer elements. The front-end IC provides a 27-V pulser and 10-MHz bandwidth amplifier for each element of the array. An FPGA-based data acquisition system is used for control and data acquisition. Output pressure of 230 kPa was measured for the integrated device. A receive sensitivity of 125 mV/kPa was measured at the output of the amplifier. Amplifier output noise at 5 Mhz is 112 nV/√Hz. Volumetric images of a wire phantom and vessel phantom are presented. Volumetric data for a wire phantom was acquired in real-time at 30 frames per second.Publisher's Versio

    Coherent-array imaging using phased subarrays. Part I: Basic principles

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    PubMed ID: 15742561The front-end hardware complexity of a coherent array imaging system scales with the number of active array elements that are simultaneously used for transmission or reception of signals. Different imaging methods use different numbers of active channels and data collection strategies. Conventional full phased array (EPA) imaging produces the best image quality using all elements for both transmission and reception, and it has high front-end hardware complexity. In contrast, classical synthetic aperture (CSA) imaging only transmits on and receives from a single element at a time, minimizing the hardware complexity but achieving poor image quality. We propose a new coherent array imaging method-phased subarray (PSA) imagine-that performs partial transmit and receive beam-forming using a subset of adjacent elements at each firing step. This method reduces the number of active channels to the number of subarray elements; these channels are multiplexed across the full array and a reduced number of beams are acquired from each subarray. The low-resolution subarray images are laterally upsampled, interpolated, weighted, and coherently summed to form the final high-resolution PSA image. The PSA imaging reduces the complexity of the front-end hardware while achieving image quality approaching that of FPA imaging.Publisher's Versio

    Volumetric imaging using fan-beam scanning with reduced redundancy 2D arrays

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    Phased array processing with a fully populated 2D array produces the best image quality but requires excessive number of active parallel front-end channels. Here we explore four array designs with reduced redundancy in spatial frequency contents. To minimize the number of firings we employ fan-beam processing, where ID arrays are used to insonify 2D planar slices of the volume at successive firing events; echo signals are collected by the receive array elements. The array designs are compared based on simulated point spread functions, frame rate, motion susceptibility, and signal-to-noise ratio.Dr. Karaman is supported by TUBITAK of Turkey through grant 106M333Publisher's Versio

    Beamforming and hardware design for a multichannel front-end integrated circuit for real-time 3D catheter-based ultrasonic imaging

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    We are working on integrating front-end electronics with the ultrasound transducer array for real-time 3D ultrasound imaging systems. We achieve this integration by flip-chip bonding a two-dimensional transducer array to an integrated circuit (IC) that comprises the front-end electronics. The front-end IC includes preamplifiers, multiplexers, and pulsers. We recently demonstrated a catheter-based real-time ultrasound imaging system based on a 16 x 16-element capacitive micromachined ultrasonic transducer (CMUT) array. The CMUT array is flip-chip bonded to a front-end IC that includes a pulser and preamplifier for each element of the array. To simplify the back-end processing and signal routing on the IC for this initial implementation, only a single array element is active at a time (classic synthetic aperture (CSA) imaging). Compared with classic phased array imaging (CPA), where multiple elements are used on transmit and receive, CSA imaging has reduced signal-to-noise ratio and prominent grating lobes. In this work, we evaluate three array designs for the next generation front-end IC. The designs assume there are 16 receive channels and that numerous transmit pulsers are provided by the IC. The designs presented are: plus-transmit x-receive, boundary-transmit x-receive with no common elements, and full-transmit x-receive with no common elements. Each design is compared with CSA and CPA imaging. We choose to implement an IC for the full-transmit x-receive with no common elements (FT-XR-NC) design for our next-generation catheter-based imaging system.Funding was provided by the National Institutes of Health. IC fabrication was provided by National Semiconductor. Bill Broach and the members of the Portable Power Group at National Semiconductor provided valuable process and circuit design discussions.Publisher's Versio

    Minimally redundant 2-D array designs for 3-D medical ultrasound imaging

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    PubMed ID: 19131299In real-time ultrasonic 3-D imaging, in addition to difficulties in fabricating and interconnecting 2-D transducer arrays with hundreds of elements, there are also challenges in acquiring and processing data from a large number of ultrasound channels. The coarray (spatial convolution of the transmit and receive arrays) can be used to find efficient array designs that capture all of the spatial frequency content (a transmit-receive element combination corresponds to a spatial frequency) with a reduced number of active channels and firing events. Eliminating the redundancies in the transmit-receive element combinations and firing events reduces the overall system complexity and improves the frame rate. Here we explore four reduced redundancy 2-D array configurations for miniature 3-D ultrasonic imaging systems. Our approach is based on 1) coarray design with reduced redundancy using different subsets of linear arrays constituting the 2-D transducer array, and 2) 3-D scanning using fan-beams (narrow in one dimension and broad in the other dimension) generated by the transmit linear arrays. We form the overall array response through coherent summation of the individual responses of each transmit-receive array pairs. We present theoretical and simulated point spread functions of the array configurations along with quantitative comparison in terms of the front-end complexity and image quality.Publisher's Versio

    Forward-viewing CMUT arrays for medical Imaging

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    PubMed ID: 15301009This paper reports the design and testing of forward-viewing annular arrays fabricated using capacitive micromachined ultrasonic transducer (CMUT) technology. Recent research studies have shown that CMUTs have broad frequency bandwidth and high-transduction efficiency. One- and two-dimensional CMUT arrays of various sizes already have been fabricated, and their viability for medical imaging applications has been demonstrated. We fabricated 64-element, forward-viewing annular arrays using the standard CMUT fabrication process and carried out experiments to measure the operating frequency, bandwidth, and transmit/receive efficiency of the array elements. The annular array elements, designed for imaging applications in the 20 MHz range, had a resonance frequency of 13.5 MHz in air. The immersion pulse-echo data collected from a plane reflector showed that the devices operate in the 5-26 MHz range with a fractional bandwidth of 135%. The output pressure at the surface of the transducer was measured to be 24 kPa/V. These values translate into a dynamic range of 131.5 dB for I-V excitation in 1-Hz bandwidth with a commercial low noise receiving circuitry. The designed, forward-viewing annular CMUT array is suitable for mounting on the front surface of a cylindrical catheter probe and can provide Doppler information for measurement of blood flow and guiding information for navigation through blood vessels in intravascular ultrasound imaging.Publisher's Versio

    Coherent array imaging using phased subarrays. Part II: Simulations and experimental results

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    PubMed ID: 15742562The basic principles and theory of phased subarray (PSA) imaging imaging provides the flexibility of reducing I he number of front-end hardware channels between that of classical synthetic aperture (CSA) imaging-which uses only one element per firing event-and full-phased array (FPA,) imaging-which uses all elements for each firing. The performance of PSA generally ranges between that obtained by CSA and FPA using the same array, and depends on the amount of hardware complexity reduction. For the work described in this paper, we performed FPA, CSA, and PSA imaging of a resolution phantom using both simulated and experimental data from a 3-MHz, 3.2-cm, 128-element capacitive micromachined ultrasound transducer (CMUT) array. The simulated system point responses in the spatial and frequency domains are presented as a means of studying the effects of signal bandwidth, reconstruction filter size, and subsampling rate on the PSA system performance. The PSA and FPA sector-scanned images were reconstructed using the wideband experimental data with 80% fractional bandwidth, with seven 32-element subarrays used for PSA imaging. The measurements on the experimental sector images indicate that, at the transmit focal zone, the PSA method provides a 10% improvement in the 6-dB lateral resolution, and the axial point resolution of PSA imaging is identical to that of FPA imaging. The signal-to-noise ratio (SNR) of PSA image was 58.3 dB, 4.9 dB below that of the FPA image, and the contrast-to-noise ratio (CNR) is reduced by 10%. The simulated and experimental test results presented in this paper validate theoretical expectations and illustrate the flexibility of PSA imaging as a way to exchange SNR and frame rate for simplified front-end hardware.Publisher's Versio

    Phased subarray imaging for low-cost, wideband coherent array imaging

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    The front-end hardware complexity of conventional full phased array (FPA) imaging is proportional to the number of array elements. Phased subarray (PSA) imaging has been proposed as a method of reducing the hardware complexity-and therefore system cost and size-while achieving near-FPA image quality. A new method is presented for designing the subarray-dependent interpolation filters suitable for wideband PSA imaging. The method was tested experimentally using pulse-echo data of a wire target phantom acquired using a 3.2-cm. 128-element capacitive micromachined ultrasonic transducer (CMUT) array with 85% fractional bandwidth at 3 MHz. A specific PSA configuration using seven 32-element subarrays was compared to FPA imaging, representing a 4-fold reduction in front-end hardware complexity and a 43% decrease in frame rate. For targets near the fixed transmit focal distance, the mean 6-dB lateral resolution was identical to that of FPA, the axial resolution improved by 4%, and the SNR decreased by 5 dB. Measurements were repeated for 10 different PSA configurations with subarray sizes ranging from 4 to 60. The lateral and axial resolutions did not vary significantly with subarray size; both the SNR and contrast-to-noise ratio (CNR) improved with increased subarray size.Publisher's Versio

    Volumetric ultrasound imaging using 2-D CMUT arrays

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    PubMed ID: 14682642Recently, capacitive micromachined ultrasonic transducers (CMUTs) have emerged as a candidate to overcome the difficulties in the realization of 2-D arrays for real-time 3-D imaging. In this paper, we present the first volumetric images obtained using a 2-D CMUT array. We have fabricated a 128 x 128-element 2-D CMUT array with through-wafer via interconnects and a 420-mum element pitch. As an experimental prototype, a 32 x 64-element portion of the 128 X 128-element array was diced and flip-chip bonded onto a glass fanout chip. This chip provides individual leads from a central 16 X 16-element portion of the array to surrounding bondpads. An 8 x 16-element poition of the array was used in the experiments along with a 128-channel data acquisition system. For imaging phantoms, we used a 2.37-mm diameter steel sphere located 10 mm from the array center and two 12-mm-thick Plexiglas plates located 20 mm and 60 mm from the array. A 4 X 4 group of elements in the middle of the 8 X 16-element array was used in transmit, and the remaining elements were used to receive the echo signals. The echo signal obtained from the spherical target presented a frequency spectrum centered at 4.37 MHz with a 100% fractional bandwidth, whereas the frequency spectrum for the echo signal from the parallel plate phantom was centered at 3.44 MHz with a 91% fractional bandwidth. The images were reconstructed by using RF beamforming and synthetic phased array approaches and visualized by surface rendering and multiplanar slicing techniques. The image of the spherical target has been used to approximate the point spread function of the system and is compared with theoretical expectations. This study experimentally demonstrates that 2-D CMUT arrays can be fabricated with high yield using silicon IC-fabrication processes, individual electrical connections can be provided using through-wafer vias, and flip-chip bonding can be used to integrate these dense 2-D arrays with electronic circuits for practical 3-D imaging applications.Publisher's Versio
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